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This paper aims to investigate the galvanic corrosion of titanium/L 316 stainless steel, by electrochemical noise (EN), electrochemical impedance spectroscopy (EIS), and anode/cathode area ratio effect on the galvanic behavior of the couple.

The EN measurement was employed to examine effects of anode to cathode area ratio on the galvanic corrosion behavior between stainless steel L 316 and titanium in artificial seawater. Current noise and potential noise were monitored simultaneously using a three‐electrode configuration under open‐circuit condition. The noise resistance was evaluated as the ratio of the standard deviation of the potential to that of the current noise after removing the DC component. The time‐series noise patterns were transformed into frequency domain by fast Fourier transformation and then their power spectrum densities (PSDs) at specified frequency were determined and compared with the EIS and polarization results.

The EN, EIS and polarization results were in agreement. Galvanic corrosion density increase and galvanic potential moved slowly to negative direction with decrease in anode/cathode area ratio. The results showed that the slope of PSD of the current (i.e the “roll off”) was rising slowly where the anode/cathode area ratio was declined. The relationship between polarization resistance (Rp) and noise resistance (Rn) was investigated. Rt was determined by EIS for samples, and its value compared with Rp and Rn. The result indicates that galvanic corrosion has an inversely relation with anode/cathode area ratio that exposed to aggressive environment.

This paper presents the application of noise analysis to demonstrate galvanic corrosion and the effect of area ratio anode/cathode on current density and galvanic potential.

The purpose of this paper is to analyze the effects of supply chain coordination on inventory management while the retailer inventory cycle consists of a shortage period and the backorder rate linearly decreases as a function of shortage duration. It is intended to consider how on‐hand inventory and shortage durations are altered when the decisions are centralized.

Mathematical modelling of inventory costs for the retailer and the vendor is used to formulate objective functions. The vendor sets his inventory period as an integer multiple (n) of the retailer inventory cycle in which the integer multiple is a decision variable. Solution spaces of models are analyzed to determine two other decision variables including, on‐hand inventory duration and shortage length.

The integrated model consists of a unique pseudo convex area when (n) is fixed and as a result, there is a unique minimum point. Based on numerical examples and sensitivity analysis, in most situations coordinated inventory management reduces total costs of the supply chain and cost reduction rate increase at larger production rates.

This paper is a combination between production‐inventory models in two‐stage supply chains and partial backordering, which has appeared in single inventory models. To the best of the authors' knowledge, no mathematical model has yet been proposed. Moreover, the benefits of synchronization are analyzed through numerical examples.

This paper aims to propose a modified full-additive method (MFAM) to fabricate fine copper lines for high density interconnection (HDI) printed circuit boards (PCBs). In addition, the surface of the fine copper lines is treated with a brown oxidation process to obtain good adhesion between the copper and the dielectric resin.

Fine copper lines fabricated by MFAM were observed to evaluate the undercut quality, in comparison to undercut quality of copper lines fabricated by the semi-additive method and the subtractive method. The effect of the thickness of the dry film on the quality of the copper plating was investigated to obtain the regular shape of fine lines. The fine copper lines treated with the brown oxidation process were also examined to generate a coarse surface microstructure to improve the adhesion between the copper and the dielectric resin. The cross section and surface of as-fabricated fine copper lines were characterized using an optical microscope, a scanning electron microscope and an atomic force microscope.

MFAM has the potential to fabricate high-performance fine copper lines for HDI PCBs. Undercut of as-fabricated fine copper lines could be prevented to meet the design requirement of impedance. In addition, fine copper lines exhibit enough adhesive force to laminate with dielectric resin after the brown oxidation process.

MFAM, with the advantages of high efficiency and being a facile process, is developed to fabricate high-quality fine copper lines for industrial HDI PCB manufacture.